FDLL485B — High Conductance, Low Leakage Diode
? 1997 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FDLL485B Rev. 1.1.0 1
April 2013
FDLL485B
High Conductance, Low Leakage Diode
Absolute Maximum Ratings(1)
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. Values are at TA
= 25°C unless otherwise noted.
Note:
1. These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
Thermal Characteristics
Electrical Characteristics
Values are at TA
= 25°C unless otherwise noted.
Symbol Parameter Value Units
WIV
Working Inverse Voltage 180 V
IO
Average Rectified Current 200 mA
IF
DC Forward Current 500 mA
if
Recurrent Peak Forward Current 600 mA
IFSM
Non-repetitive Peak Forward Current
Pulse Width = 1.0 s 1.0 A
Pulse Width = 1.0 μs4.0A
TSTG
Storage Temperature Range -65 to +200
°C
TJ
Operating Junction Temperature -65 to +200
°C
Symbol Parameter Value Units
PD
Power Dissipation 500 mW
Linear Derating Factor from TA
= 25
°C3.33mW/°C
RθJA
Thermal Resistance, Junction to Ambient 350
°C/W
Symbol Parameter Conditions Min. Max. Units
VR
Breakdown Voltage IR
= 100
μA200 V
VF
Forward Voltage IF
= 100 mA 1.0 V
IR
Reverse Leakage
VR
= 180 V 25 nA
VR
= 180 V, T
A
= 150
°C5.0μA
CTTotal Capacitance VR
= 0, f = 1.0 MHz 6.0 pF
Cathode Band
SOD80
Description
A general purpose diode that couples high forward con-
ductance fast swiching speed and high blocking voltages
in a glass leadless LL-34 surface mount package. Place-
ment of the expansion gap has no relationship to the
location of the cathode terminal which is indicated by the
first color band.
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